In June 2023, the project titled Advanced Temporary Bonding Materials and Equipment for IC Packaging, jointly developed by Shenzhen Samcien New Material Technology Co., Ltd., Shenzhen Institutes of Advanced Technology (CAS), Shenzhen International Innovation Institute of Advanced Electronic Materials, and Shenzhen Han’s Semiconductor Equipment Technology Co., Ltd., was awarded the Second Prize of the 2022 Shenzhen Science and Technology Progress Award. Recently, the Shenzhen Municipal People’s Government issued an honorary certificate to recognize the award-winning project and its contributors.
Congratulations!
The Shenzhen Science and Technology Award is hailed as the "Oscar" of Shenzhen's tech community. It recognizes projects that deliver major scientific and technological innovations, achieve effective commercialization of research findings, embody the city's strength in innovation, and generate remarkable economic benefits. Winning the Shenzhen Science and Technology Progress Award is a recognition of Samcien Semiconductor’s years of technological expertise and market contributions in advanced IC packaging materials. It also serves as a great inspiration for us to pursue further technological innovation and exploration in the future.
The awarded temporary bonding material is one of Samcien Semiconductor's core products. It is mainly used to hold ultra-thin wafers during processing for ultra-thin chip fabrication and wafer reconstitution. Boasting excellent physical and mechanical properties, strong adhesion, superior heat and chemical resistance, as well as easy debonding and residue-free cleaning performance, it meets the stringent process requirements for high-end chip manufacturing. It is a key material for advanced packaging technologies including 2.5D/3D, CoWoS, HDFO, SiP and PoP. This technology has been widely applied to the packaging and production of high-end chips such as high-computing power and high-bandwidth memory chips for 5G, AI and data centers.
Going forward, Samcien Semiconductor will stay committed to continuous technological innovation. We will keep focusing on sustainable R&D of advanced electronic materials, deliver comprehensive solutions for clients, and fuel the development of the broader semiconductor industry.
About Us
Shenzhen Samcien New Material Technology Co., Ltd. was established in 2016 upon technology transfer and commercialization by the Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences. It focuses on the R&D and industrial application of high-end semiconductor materials. Centering on three strategic emerging areas — advanced IC packaging, power devices and new display technologies — the company is dedicated to providing customers with key materials and system solutions.
Zhejiang Samcien New Materials Technology Co., Ltd. is a wholly-owned subsidiary of Shenzhen Samcien New Material Technology Co., Ltd. Located in Jiashan Economic Development Zone, Zhejiang Province, it has a building area of 24,000 square meters. The company is equipped with clean workshops for mass production of advanced electronic materials and an MES production management system, and boasts strong quality control capabilities for high-end electronic materials.
