On August 6th, the 2026 CP Wong Global Electronic Packaging Award Ceremony was held in Xi'an. Zhang Guoping, founder and chairman of Shenzhen Samcien New Materials Technology Co., Ltd. (referred to as "Samcien New Materials"), was awarded the 2026 CP Wong Global Electronic Packaging Youth Award for his groundbreaking theoretical breakthroughs and engineering applications in the field of temporary bonding materials.
This award is presented annually at the International Conference on Electronic Packaging Technology (ICEPT) hosted by the IEEE Electronic Packaging Society to recognize outstanding elites who have made outstanding contributions and achievements in the field of electronic packaging. ICEPT, as the largest and most cohesive packaging technology conference in Asia, provided funding sponsorship for the award. This award is evaluated by a multi round judging committee composed of experts from multiple countries including the Americas, Asia, and Europe, and is awarded to only 2 people worldwide each year. The winners in 2025 will be Dr. Liu Hancheng of Xinxing Electronics in Taiwan, China, China, and Dr. Rene Poelma of NXP in the Netherlands.
From 'dependence on imports' to' competition on the same stage '
In 2016, Samcien New Materials was incubated and established by the Chinese Academy of Sciences Shenzhen Advanced Technology Research Institute. Over the past decade, Chairman Zhang Guoping has led a team to tackle advanced electronic packaging materials and focus on advanced temporary bonding materials for packaging. The team has independently innovated from the structural design, synthesis to formulation of polymer materials, gradually approaching the mass production goal. As Moore's Law approaches its physical limits, advanced packaging technology has become a new engine to meet the needs of miniaturization and multifunctionality of integrated circuits, and temporary bonding materials are one of the key materials for advanced packaging such as artificial intelligence chips. In advanced packaging processes, wafers need to be thinned to below 100 μ m, which is prone to warping and damage. It relies entirely on temporary bonding materials to assist in completing all demanding processes. Temporary bonding materials should not only be "sticky" - able to withstand chemical corrosion from high temperatures of 300 ℃ and strong acids and alkalis, but also not stick too firmly, causing damage to the wafer during debonding; Also, it needs to be applied evenly - there should be no air bubbles or particle contamination; It also needs to be 'solvable' - with no stress separation and zero residue, any small fluctuation in a parameter can potentially render expensive advanced process wafers unusable. This huge challenge has led to the long-term monopoly of foreign companies in the material field, and before 2018, domestic integrated circuit companies relied entirely on imports.
Temporary bonding material
In 2018, Chairman Zhang Guoping led a team to successfully introduce temporary bonding materials into advanced wafer level packaging processes, taking the lead in achieving commercial mass production of temporary bonding materials in China. The team continues to overcome technological barriers and develop domestically produced temporary bonding materials that meet the advanced packaging process of 2.5D CoWoS. This complete set of temporary bonding materials has successfully served the mass production of general-purpose computing server chips (CPUs) and artificial intelligence chips (GPUs) for leading domestic chip design enterprises. Nowadays, the temporary bonding materials for ultra-thin chip processing developed by Chairman Zhang Guoping and his team have made a leap from laboratory to industrial application, entering the international top tier and possessing the strength to compete head-on with top foreign enterprises, becoming the main team in China that can provide complete solutions.
The platform support behind the achievements
Material innovation is never a single breakthrough. The "72 flight inspections" a year have made the team deeply realize that in order for domestic materials to make a name for themselves, they must have a tenacious and persevering spirit and a full chain research and development platform. In 2019, with the support of resources from Shenzhen Advanced Electronic Materials International Innovation Research Institute, Yunzhuo New Materials jointly established a joint laboratory with it. Various projects can rely on the domestically pioneered advanced packaging material "R&D - testing - pilot testing - verification" fully closed-loop platform of the institute, covering the entire process of material verification and process development of mainstream advanced packaging technology. Materials from formulation to production line verification no longer have to travel thousands of miles, laying the foundation for breaking through the key "barriers" of domestic high-end electronic materials and laying the platform.
If the road is blocked and long, then the journey will come. This honor belongs to the R&D and industry personnel of Yunzhuo New Materials' advanced electronic packaging material innovation team who are deeply involved in the field of integrated circuits. It is also a vivid achievement of the Shenzhen Advanced Institute of the Chinese Academy of Sciences in building an innovation platform and accelerating the transformation of scientific and technological achievements. The journey is long, only struggle. In the future, Samcien New Materials will continue to focus on the industry's essential needs, concentrate on technological innovation, overcome difficulties, and contribute to the independent and controllable development of China's integrated circuit industry chain.
