Driven by the dual trends of global energy structure transformation and intelligence, the application boundaries of compound semiconductors are continuously expanding with unprecedented depth and breadth. From new energy, intelligent vehicles, photovoltaic energy storage to AI powered global data centers, market demand is showing an exponential leap, becoming the core engine driving new quality productivity and reshaping the global technology industry landscape.  

As the enterprise with the deepest technical accumulation, the most complete product matrix, and the widest application scenarios in the field of temporary bonding in China, Samcien New Materia will bring a full range of solutions such as temporary bonding materials for power devices, Micro LED bulk transfer materials, and wafer level chemical plating protective films to highlight this grand event. We sincerely invite you to visit the site and explore new chapters in the industry together.