Gathering Dreams and Creating the Future The spring tide surges and gathers strength, the grand event comes to an end and begins a new journey! On March 25-27, 2026, the three-day SEMICON CHINA 2026 global semiconductor industry flagship event came to a successful conclusion at the Shanghai New International Expo Center. Shenzhen Samcien New Materials Technology Co., Ltd. (referred to as "Samcien New Materials") was invited to participate in the exhibition, bringing core technology and innovative products to showcase the company's technological breakthroughs and industrial accumulation in the field of advanced electronic materials. Together with global semiconductor industry partners, we explore new opportunities in the industry and draw a new blueprint for localization.
01 A group of wise people come together to discuss the core path
As the largest and most extensive semiconductor industry event in the Asia Pacific region, SEMICON CHINA 2026 gathers resources from the entire industry chain, covering core areas such as chip design, manufacturing, packaging and testing, equipment, and materials, with a focus on AI computing power HBM、 Advanced packaging, Chiplets, CPO and other cutting-edge hotspots attract global semiconductor leaders to gather and compete on the same stage. In this exhibition, Samcien New Materia' booth located at No. 2243, N2 Hall stood out as one of the focal points of the exhibition with its simple and atmospheric display style, full range of core product matrix, and professional and detailed technical explanations. It attracted a large number of exhibitors and industry partners to stop and consult, and conducted in-depth negotiations. The atmosphere on site was warm and orderly.
02 Technology Exhibition: Striving for Win Win Cooperation
During the exhibition, the Samcien New Materia technology team adhered to a professional and enthusiastic service concept, deeply connected with on-site guests, and conducted in-depth exchanges on the technological development trends, industry application pain points, and localization promotion paths of advanced electronic materials. They comprehensively demonstrated the core technological strength and mature application achievements of the company's full range of core products in advanced packaging, packaging substrates, power devices, new displays, and other fields to domestic and foreign merchants. With excellent product performance, stable quality performance, and outstanding localization substitution advantages, Yunzhuo New Materials has won high recognition and widespread favor from numerous customers on site. Multiple cooperation intentions have been successfully reached on site, laying a solid foundation for deepening technical cooperation, expanding market layout, and achieving mutual benefit and win-win results in the future.
03 Innovation is not just about moving towards the future
The end of SEMICON CHINA 2026 is not the endpoint, but a new starting point for innovative endurance and deepening cooperation. In the future, Yunzhuo New Materials will continue to deeply cultivate the field of advanced electronic materials, with technological innovation as the core driving force, industry demand as the guide, focusing on the industry's "bottleneck" material problems, accelerating technological breakthroughs and product iteration, providing more competitive products and customized solutions for domestic semiconductor leading enterprises, continuously improving the independent and controllable ability of the semiconductor industry chain, and empowering the global semiconductor industry to develop high-quality innovation.
