Shenzhen Samcien New Materials Technology Co., Ltd.
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Samcien Semiconductor Claims the "Best Cooperation Award" from China IC Materials Innovation Alliance
2021 China Semiconductor Materials Innovation and Development Conference
This year marks the start of China's 14th Five-Year Plan. Amid tight supply chains for the semiconductor industry at home and abroad, we also embrace new development opportunities. To pool the strengths of the entire domestic IC manufacturing industry chain and expertise from all sectors, and enhance communication between upstream and downstream players in the IC materials sector, the China Integrated Circuit Materials Innovation Alliance (hereinafter referred to as the Materials Alliance) and the Semiconductor Support Industry Branch of China Semiconductor Industry Association, together with the IC Branch of China Semiconductor Industry Association, IC Equipment Innovation Alliance, IC Components Innovation Alliance, IC Packaging & Testing Innovation Alliance and China IC Testing Innovation Alliance, grandly hosted the 24th China IC Manufacturing Annual Conference & Supply Chain Innovation and Development Conference as well as the 2021 China Semiconductor Materials Innovation and Development Conference in Guangzhou on November 3rd, with the theme of "New Start, New Challenges, New Momentum and New Vitality for the IC Industry".
The 2nd Award Ceremony for IC Materials Awards
Meanwhile, to encourage technological innovation among member enterprises engaged in IC materials, accelerate the industrialization of research achievements, and boost coordinated development and close cooperation across the industrial chain, the Materials Alliance launched the 2nd IC Materials Awards. This edition features six categories: Technology Breakthrough Award, Rising Star Enterprise Award, Best Cooperation Award, Outstanding Contribution Award, Fast Growth Award and Five-Star Product Award.
Shenzhen Samcien New Materials Technology Co., Ltd. (referred to as Samcien Semiconductor), JCET (Shaoxing) Co., Ltd. (referred to as JCET Shaoxing) and Shenzhen International Innovation Research Institute of Advanced Electronic Materials (referred to as the Electronic Materials Institute) worked together on the project of "Localization of Temporary Bonding Materials for High-density Fan-out Packaging". Through industry-university-research cooperation, they made breakthroughs in core technologies of advanced packaging materials and achieved large-scale mass production and application. The three parties were presented with the Best Cooperation Award by the China IC Materials Innovation Alliance, being one of the five recipients of this award. The award commends enterprises and teams that have made outstanding contributions to advancing the localized mass production and application of materials as well as promoting cooperation between upstream and downstream players and among industry, universities and research institutes in the industrial chain.
Best Cooperation Award
Localization of Temporary Bonding Materials for High-Density Fan-Out Packaging
Temporary bonding process is one of the key procedures for advanced IC packaging including fan-out packaging and 2.5D/3D packaging. Temporary bonding materials play a vital role in process implementation and yield. Targeting the key technical challenges of temporary bonding materials for fan-out wafer-level packaging, Samcien Semiconductor and the Electronic Materials Institute jointly tackled core technologies and built a joint laboratory for industry-university-research cooperation. Their research covers material synthesis, formulation, as well as the structure-performance relationship of processes and properties. The team also collaborated with JCET Shaoxing on material and process application development. Thanks to the joint efforts of the three parties, multiple technical bottlenecks have been overcome. Independent intellectual property patents have been obtained, and mass production for ultra-high density fan-out packaging has been successfully realized.
The localization of high-end electronic materials is a long and arduous journey that requires the joint efforts of all partners across the industrial chain. Samcien Semiconductor will continue to deliver more high-quality high-end electronic materials to serve customers and achieve win-win results for all parties. We strive to become a respected enterprise in the field of advanced packaging electronic materials.
About Us
Founded in 2016 via technology transfer from Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, Shenzhen Samcien New Materials Technology Co., Ltd. focuses on the R&D and industrial application of high-end semiconductor materials. Centering on three strategic emerging sectors including advanced IC packaging, power devices and new display technologies, the company is dedicated to providing customers with key materials and systematic solutions.
Zhejiang Samcien New Materials Technology Co., Ltd. is a wholly-owned subsidiary of Shenzhen Samcien New Materials Technology Co., Ltd. Located in Jiashan Economic Development Zone, Zhejiang Province, it covers a building area of 24,000 square meters. Equipped with clean workshops and MES production management system for mass production of advanced electronic materials, the company also boasts strong quality control capabilities for high-end electronic materials.
