The build-up insulation dielectric film (BUF) is compatible with the semi-additive process (SAP). It serves as interlayer insulation for FCBGA substrate circuits, featuring high reliability, low dielectric properties, low copper surface roughness and excellent adaptability for fine-line fabrication. It is mainly applied to computing chips such as CPU, GPU and AI chips.
| Product | Product Introduction |
| Build‑up Film | Our Build-Up Film (BUF) material, specifically engineered for high-layer-count FCBGA package substrates, delivers exceptional planarity, a low coefficient of thermal expansion (CTE), and ultra-low dielectric loss. It is fully compatible with fine-line/space patterning and laser micro-via formation—critical processes that enable high-density package substrate manufacturing. . |
