Samcien New Materials provides high-reliability photoimageable solder resist films for FCBGA/FCCSP packaging substrates, which are mainly used in consumer electronics, memory chips and high-computing AI chips.
| Product | Product Introduction |
| FCCSP Substrate Solder resist Film | We supply solvent-free photoimageable solder resist film with high flatness and high modulus for FCCSP substrates. It meets the requirements of high reliability and miniaturized packaging, and ensures excellent insulation and stable signal transmission of substrates. |
| FCBGA Substrate Solder resist Film | We provide solder resist film with fine SRO opening accuracy and high crack resistance for FCBGA packaging substrates. It delivers reliable insulation for large-size FCBGA substrates and ensures long-term service life and stability in harsh environments. |
