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Wafer Processing Materials
Wafer Processing Materials

Samcien New Materials provides product solutions including laser dicing protective liquid and photoresist adhesion promoters for the processing of power device wafers.

Figure 1 Wafer Laser Dicing Process Flow
Figure 1 Wafer Laser Dicing Process Flow
Figure 2 Photoresist Adhesion Promoter Process Flow
Figure 2 Photoresist Adhesion Promoter Process Flow
Product Details
ProductProduct Introduction
Wafer Laser Dicing Protective Fluid
We supply water-soluble laser dicing protective fluid for wafer laser dicing processes. It is compatible with UV and IR laser dicing, effectively reducing heat-affected zone (HAZ) and blocking particle contamination to guarantee good edge quality of chips.
Photoresist adhesion promoterWe offer amino-reactive and double-bond reactive photoresist adhesion promoters to enhance the adhesion between photoresist and wafer surfaces.


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