In the manufacturing of power devices, Samcien New Materials supplies infrared laser release materials, thermal sliding temporary bonding polymer and thermal sliding temporary bonding wax, catering to the processing of 4- to 12-inch ultra-thin compound semiconductor wafers.
| Product | Product Introduction |
|
UV-curable temporary bonding materials |
We provide UV-curable temporary bonding materials for wafer thinning processes of large-size silicon-based IGBT and SiC. Debonding is realized via infrared laser. These materials feature high UPH, peelable adhesive layer and recyclable glass wafers. |
| Infrared laser release materials | |
| Thermal sliding temporary bonding adhesive | We supply temporary bonding polymer with excellent heat and chemical resistance for the thinning of 4-inch, 6-inch and 8-inch wafers such as GaAs, SiC, GaN and InP, which effectively supports the processing of RF, MEMS and other chips. |
| Thermal sliding temporary bonding wax | We offer debondable bonding wax for different temperature ranges for the thinning of 4-inch, 6-inch and 8-inch wafers including GaAs, SiC, GaN and InP. Compared with bonding polymer, this wax features simpler processes, superior TTV performance, and can be directly removed with acetone or IPA. The combined use of high-temperature and low-temperature waxes is also applicable to the processing of high-bump devices and MEMS wafers with micro/nano structures, effectively protecting the microstructures from shear-force-induced damage. |
