Developed by Samcien New Materials, the redistribution layer insulating dielectric film is designed for interlayer insulation of RDL in 2.5D CoWoS-R, FO-WLP and FO-PLP packaging. It supports the fabrication of large-size organic interposers and delivers technical solutions for multi-chip interconnection and high-density integration of high-computing AI chips.
| Product | Product Introduction |
| Redistribution Layer (RDL) Insulating Dielectric Film | The redistribution layer insulating dielectric film features low dielectric loss, low coefficient of thermal expansion and high flatness. It is suitable for the fabrication of organic interposers in advanced packaging and meets the requirements for ultra-fine circuit processing. |
