Samcien New Materials has independently developed a full range of Tapes for ultra-thin wafer processing, which are used for backside protection during chemical plating and cleaning of ultra-thin wafers. Our products serve high-end fields such as digital chips and power devices.
| Product Category | Product | Product Introduction |
| Protective Tapes | Wafer plating Protective Tapes | This Tapes protects the non-plated surfaces during wafer plating. It features outstanding heat resistance and acid & alkali resistance and leaves no residue after UV debonding and peeling. |
| Ultra-thin Wafer Cleaning Protective Tapes | We provide protective Tapes with excellent resistance to polar and non-polar cleaning agents for the cleaning process of ultra-thin wafers after debonding. |
