Samcien provides a comprehensive temporary bonding solution that fully supports advanced packaging processes such as 2.5D, 3D, FOWLP, and FOPLP. We focus on serving sectors including 5G, AI, HPC, and IoT, enabling the mass production of high-compute, high-bandwidth memory chips.
| Product Category | Product | Product Introduction |
Temporary Bonding Materials （Adhesive Layer） | 2.5D CoWoS Temporary Bonding Material | We supply temporary bonding materials with outstanding support, high temperature resistance and easy-to-clean properties for TB1 and TB2 processes in CoWoS advanced packaging, catering to temporary bonding needs for ultra-thin wafer processing and multi-chip heterogeneous integration. |
| 3D HBM Temporary Bonding Material | We offer mechanical debonding and laser debonding material solutions for 3D stacking of HBM memory chips. The products deliver excellent bonding TTV performance, effectively supporting wafer BVR and TCB processes. | |
| Hybrid Bonding Temporary Bonding Material | We provide temporary bonding materials with excellent TTV performance and high-temperature stability for 3D packaging hybrid bonding processes, enabling ultra-thin wafers to complete Cu-Cu bonding under high-temperature conditions. | |
| FOWLP/FOPLP Temporary Bonding Material | We provide high-temperature and high-modulus temporary bonding materials for Chip-First HDFO packaging, meeting die attach requirements for both wafer-level and panel-level processes. | |
Laser Release Material (Release Layer) | UV Laser Release Material | It meets the debonding requirements for 308nm and 355nm lasers. Our laser release materials feature excellent UV absorption and chemical resistance, suitable for various advanced packaging processes. |
| Green Laser Release Material | Suitable for 532nm green laser debonding processes. Our laser release materials boast excellent visible light absorption performance. | |
Stripping Solution (Stripper) | Temporary Bonding Remover | Samcien New Materials provides matching removers for various temporary bonding materials. They feature high cleaning efficiency and cause no corrosion to UV films, wafer surface metals or PI dielectrics. |
Substrate Materials (Glass Carrier) | Glass Wafer | Samcien New Materials offers glass materials with various CTE specifications for HDFO, 2.5D and other advanced packaging processes. They feature superior dimensional accuracy and strict control over particles and defects. |
