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Good News! Samcien New Materials has been officially approved as Guangdong Engineering Technology Research Center.
Release Date:2026/01/27 19:32:16


Warm Congratulations


Hard work bears fruitful achievements; we set sail for new journeys. Warm congratulations to Shenzhen Samcien New Material Technology Co., Ltd. (formerly Shenzhen Samcien Semiconductor Materials Co., Ltd., hereinafter referred to as "Samcien New Materials") on the official approval of **Guangdong Engineering Technology Research Center for Advanced IC Packaging Materials**.







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Provincial Engineering Technology Research Center is a key benchmark for evaluating an enterprise's innovation capacity, R&D strength and achievement transformation efficiency. This approval is an authoritative recognition of our expertise in core technology R&D and advanced electronic material innovation, and also builds a higher-level R&D support system for our development in advanced IC packaging materials.


Relying on Samcien New Materials' technical expertise and industrial experience in advanced packaging materials, the research center will further integrate internal and external innovation resources. It will conduct forward-looking technological research focusing on intelligence, environmental friendliness and high efficiency, and drive the high-end transformation of advanced electronic materials.


Taking this as a new starting point, Samcien New Materials will keep strengthening independent innovation and industrial collaboration. Leveraging the research center as a platform, we will accelerate the delivery of influential technological achievements and comprehensive solutions, fuel innovation in advanced IC packaging materials and boost high-quality development of the industry.



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About Us


Established in 2016, Shenzhen Samcien New Material Technology Co., Ltd. is a national specialized, sophisticated, unique and innovative "Little Giant" enterprise focusing on the R&D, production and sales of core materials for advanced IC packaging. Centering on the trend of thinner, lighter, smaller and more compact integrated circuits, we provide systematic solutions and key materials for advanced packaging, packaging substrates, power devices, new displays and other fields.



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