三维硅通孔技术

发布日期:2018/4/25
[1]  Qiang Liu,Guoping Zhang,Rong Sun,S.W.Ricky Lee,C.P.Wong.Investigation the effect of silane onto fabricating polymer insulation layer by spin-coating for through silicon vias.International Conference on Electronic Packaging Technology (ICEPT),2017,1537-1541

[2]  Lulu Zhuang,Kun Jiang,Guoping Zhang,Jiaoning Tang,Rong Sun, S W Ricky Lee,O2 Plasma Treatment in polymer insulation process for Through silicon vias.International Conference on Electronic Packaging Technology(ICEPT),2014,235-238