临时键合技术

发布日期:2018/4/25

[1] 张国平,夏建文,刘强,黄明起,陈伟,孙蓉,汪正平,面向超薄柔性器件加工的激光解键合方案。纺织学报。2018,5(39),155-159.

[2]Jinhui Li ;  Qiang Liu ;  Guoping Zhang ;  Bin Zhao ; Rong Sun ;  Ching-Ping Wong. Thermally Reversible and Crosslinked Polyurethane Based on Diels-Alder Chemistry for Ultrathin Wafer Temporary Bonding at Low-Temperature。Electronic Components and Technology Conference (ECTC), 2017 IEEE 67th,746-751.

[3]Jianwen Xia,Guoping Zhang,The effect of curing process on laser releasable de-bonding temporary material for 3D packages.International Conference on Electronic Packaging Technology (ICEPT),2017,1533-1536

[4]  Qiang liu,Guoping Zhang,Rong Sun,S W Ricky Lee.influence of rubber nanoparticles on the properties of Navolac-diazonaphthoquinone based photoresist.International Conference on Electronic Packaging Technology (ICEPT),2015,1039-1042

[5]  Libo Deng,Haoming Fang,Xingtian Shuai,Rong Sun,Preparation of reversibie thermosets and their application in temporary adhesive for thin wafer handing,Electronic Components and Technology Conference(ECTC),2015,1197-1201

[6] Xingtian Shuai, Rong Sun, Guoping Zhang, Libo Deng. A novel temporary adhesive for thin wafer handling.Electronic Packaging Technology (ICEPT), 2014, 256-261

[7] 帅行天,张国平,邓立波,孙蓉,李世球,汪正平,用于薄晶圆加工的临时键合胶,集成技术,2014,6,102-110.